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IMPROVING BATWING POWER DISSIPATION

內(nèi)容簡(jiǎn)介

Allegro MicroSystems’ stepper motor ICs are
power ICs encapsulated in DIP (dual in-line), SOIC
(small outline integrated circuit), and PLCC (plastic
leaded chip carrier) packages. The silicon die is
directly bonded to a heat-spreading lead frame
(batwing) for efficient heat transfer to an external heat
sink, or to a copper ground plane on the printed
wiring board.

下載說(shuō)明
發(fā)布公司：Allegro
更新時(shí)間：2009-12-30		 文件大?。?0.4 Kb
下載次數(shù)： 58